Epson SED 1520 Series Manual do Utilizador descarregar pdf (Página 13)

SED1520 Series

2–4 EPSON

PAD

Pad Arrangement

Chip specifications of AL pad package

Chip size: 4.80×7.04×0.400 mm

Pad pitch: 100×100 µm

Chip specifications of gold bump package

Chip size: 4.80×7.04×0.525 mm

Bump pitch: 199 µm (Min.)

Bump height: 22.5 µm (Typ.)

Bump size: 132×111 µm (±20 µm) for mushroom

model

116×92 µm (±4 µm) for vertical model

Note: An example of SED1520D

AA die numbers is given. These numbers are the same as the bump

package.

100 95 90 85

35 40 45 50

D1520D *

4.80 mm

7.04 mm

(0, 0)

1 2 ... 8 9 10 11 12 13 14 15 16 17 18 ... 39 40

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Epson SED 1520 Series Manual do Utilizador Página 13